A world leader and innovator in Semiconductor devices producing Silicon based devices for a range of industries including mobile phones, automotive, lighting and solar applications seeks a Semiconductor Process Engineer for the development of MEMS processing. Undertaking the full range of activities of process development from research to process introduction including identifying new equipment, you will be developing a range of MEMS processes including: • Release Layer Processing; • LIGA ( UV Lithography Electroplating and Molding); • Deposition methods such as ALD, Epitaxy ( Atomic Layer Deposition ) and Electroplating; • Lithography methods using SU8 including Thick Film / Thin Film Photoresist processing; plus • Etch methods such as Wet Etch, Dry Etch – RIE / Deep RIE. You will undertake full Process Characterisation including a range of Surface Science instrumentation and maintain Process Controls using techniques such as SPC, DOE, Taguchi, TPM or 6 Sigma methods to manage various process engineering issues such as Yield, Cost, Cycle time and Quality, while Project Managing the process development through techniques such as KT. PhD / MSc+ in Physics or Materials Science, ideally with industrial experience in MEMS Semiconductor processing. Knowledge of Magnetic Thin Film Devices and other MEMS related processes such as Electro Discharge Machining ( EDM ), Deep Reactive Ion Etching ( DRIE ), Electroplating, Polymer Embossing / Micro Hot Embossing, Wafer to Wafer Bonding, CMP Planarisation, Grinding / Polishing, Screen-printing, or Nano Imprint advantageous. As will be other Semiconductor manufacturing processes such as Photolithography, Diffusion, CVD, etc.. This is an exciting opportunity to work for one of the foremost semiconductor manufacturers in the world, where you will be interacting with their international base as you help to develop their Micro Electro Mechanical ( Microelectromechanical ) Systems technology. More vacancies at www.remjobs.co.uk SKILLS: Process Engineer, Silicon, Research, Release Layer Processing, LIGA, Lithography, ALD, Epitaxy, Electroplating, Thick Film Photoresist, SU8, Wet Etch, Dry Etch, RIE, Deep RIE, Process Characterisation, Surface Science, Process Controls, SPC, DOE, Taguchi, TPM, 6 Sigma, Yield, Cost, Cycle time, Quality, Project Managing, KT, PhD, MSc, Physics, Materials Science, Magnetic Thin Film Devices, Electro Discharge Machining, EDM, Deep Reactive Ion Etching, DRIE, Electroplating, Polymer Embossing, Micro Hot Embossing, Wafer to Wafer Bonding, CMP Planarisation, Grinding, Polishing, Screen-printing, Nano Imprint, Manufacturing, Photolithography, Diffusion, CVD, Micro Electro Mechanical Systems, Microelectromechanical Systems.
