pSemi Corporation is a Murata company driving semiconductor integration. pSemi builds on Peregrine Semiconductor’s 30-year legacy of technology advancements and strong IP portfolio but with a new mission—to enhance Murata’s world-class capabilities with high-performance semiconductors. With a strong foundation in RF integration, pSemi’s product portfolio now spans power management, connected sensors, optical transceivers, antenna tuning and RF frontends. These intelligent and efficient semiconductors enable advanced modules for smartphones, base stations, personal computers, electric vehicles, data centers, IoT devices and healthcare. From headquarters in San Diego and offices around the world, pSemi’s team explores new ways to make electronics for the connected world smaller, thinner, faster and better.
Job Description:
The Senior Engineer, Packaging will provide package engineering development for new pSemi IC products with a focus on laminate substrate products. This will include elements of new product development, package design, assembly characterization and qualification, interfacing with off-shore assembly contractors, and sustaining production issues. The assigned projects will be diverse in scope and will use data analysis to drive most decisions. This position will be expected to coordinate activities with other engineers working on the project.
This position will report to the Senior Manager, Packaging and Assembly
This position has responsibility for:
Driving package solutions from concept to production Supporting activities in the design and development of laminate substrates for single chip ICs and for System in Package Implementing package feasibility studies and package selection efforts for new products Coordinating package development with new product development teams, operations and off-shore assembly, laminate and bump suppliers Planning and execution of package characterization DOEs Defining appropriate bill of materials for new packages at production assembly suppliers Ensuring proper assembly process characterization of proposed package BOM Leading failure analysis and problem resolution in the development process or production environment Supporting sustaining production, quality issues and yield improvement
Competency Requirements
In order to perform the job successfully, an individual should demonstrate the following competencies:
Driving for Results: Aggressively pursues challenging goals and objectives; will put in considerable time and effort to accomplish objectives; takes a highly focused, goal driven approach toward work Acting Decisively: Moves quickly to make decisions and commit to a clear course of action; comfortable making decisions based on partial information; willing to take risks in order to maintain momentum; shows a strong bias toward action Acting as a Champion for Change: Challenges the status quo; encourages people to question existing methods, practices, and assumptions; supports people in their efforts to try new things Critical thinking: Skilled at finding logical flaws in arguments and plans; identifies problems and solutions that others might miss; provides detailed insight and constructive criticism into problems and complex situations Working with Ambiguity: Achieves forward progress in the face of poorly defined situations and/or unclear goals; able to work effectively with limited or partial information
Minimum Qualifications (Experience and Skills)
Minimum 5 years of experience in related field or 3 years with a Master’s Degree, preferably in the semiconductor manufacturing field Proficiency using Cadence APD+/SIP package design software Understanding of RF packaging requirements Test, equipment and device troubleshooting capability Experience with electrical, mechanical or thermal modeling Exposure to manufacturing environment Skilled with computers, takes advantage of new technology, learns new tools quickly, uses technology to enhance job performance Meets deadlines in a fast-paced environment, self-motivated, works independently, accountable, maintains focus, punctual, good attendance record Team player who takes initiative, seeks new opportunities, and who has a sense of urgency and strives to see projects to completion Excellent communications skills are required (verbal and written Proactive approach to communicating with customers, peers, subcontractors and management
Preferred Qualifications
Understanding the chip design and manufacturing process and its interaction with packaging and assembly. Understanding materials properties and interactions Experience with package assembly process development Experience with statistical analysis software/tools Experience designing laminate substrates for DFM (design for manufacturing review). Experience documenting laminate design rules, package PDK’s Technical knowledge of flip chip, CSP, plastic wire bond packaging, SIP packaging Understanding of package design tradeoffs Experience with electrical and/or thermal modeling Understanding basic semiconductor quality and reliability requirements Demonstrated experience with DOE methodology Understanding package reliability and failure modes Experience driving assembly process characterization activities Excellent communications skills Expertise with Autocad
Education Requirements
Bachelor’s or Master’s degree in Engineering (Packaging, Electrical, Mechanical, Materials, Nano or Chemical), Physics or Chemistry
Work Environment
This job operates in a professional office environment. This role routinely uses standard office equipment.
Physical Demands
The physical demands described here are representative of those that must be met by an employee to successfully perform the essential functions of this job. While performing the duties of this job, the employee is regularly required to talk or hear. The employee frequently is required to stand; walk; use hands to finger, handle or feel; and reach with hands and arms. Specific vision abilities required by this job include close vision, distance vision, color vision, peripheral vision, depth perception and ability to adjust focus. This position requires the ability to occasionally lift office products and supplies, up to 20 pounds
pSemi Corporation supports a diverse workforce and is committed to a policy of equal employment opportunity for applicants and employees. pSemi does not discriminate on the basis of age, race, color, religion (including religious dress and grooming practices), sex/gender (including pregnancy, childbirth, or related medical conditions or breastfeeding), gender identity, gender expression, genetic information, national origin (including language use restrictions and possession of a driver’s license issued under Vehicle Code section 12801.9), ancestry, physical or mental disability, legally-protected medical condition, military or veteran status (including “protected veterans” under applicable affirmative action laws), marital status, sexual orientation, or any other basis protected by local, state or federal laws applicable to the Company. pSemi also prohibits discrimination based on the perception that an employee or applicant has any of those characteristics, or is associated with a person who has or is perceived as having any of those characteristics.
Note: The Peregrine Semiconductor name, Peregrine Semiconductor logo and UltraCMOS are registered trademarks and the pSemi name, pSemi logo, HaRP and DuNE are trademarks of pSemi Corporation in the U.S. and other countries. All other trademarks are the property of their respective companies. pSemi products are protected under one or more of the following U.S. Patents: http://patents.psemi.com