Position Overview
The successful candidate will focus on the design and fabrication of microstructures and nanostructures in a variety of materials, including silicon and plastics. Knowledge in the areas of photolithography, wet/dry etching, thin film deposition, and cleanroom operation are required. Tasks include developing photomasks, photoresist processing, deposition of conductive materials either through layered deposition or electroplating, wet etching (using HF or other etchant materials) or dry etching (reactive ion etching, deep reactive ion etching), and using a variety of metrology techniques (scanning electron microscopy, scanning profilometry) to characterize those materials. Expertise in the area of nano-patterning, nanoimprint lithography, and injection molding would be helpful. This person will also supervise activities in the cleanroom and thus, knowledge in cleanroom operation is imperative. Experience with AutoCAD and CAD/CAM software is helpful. The person hired into this position may provide leadership or supervision over staff and students.
Job Description
30%- Confers with faculty members, research associates, and graduate students on the design, modification, and construction of microstructures and nanostructures in a variety of materials and executes operations required to realize the fabrication of devices. Uses thorough knowledge of tools, materials and techniques associated with all phases of lithography.
25%- Constructs micro-electro-mechanical systems (MEMS) or nano-electro-mechanical systems (NEMS) from either existing plans or from rough outlines of the design. Uses all techniques of the MEMS and NEMS areas to facilitate the design and fabrication of said devices.
15%- Oversees and maintains microfabrication and nanofabrication equipment used by research groups as well as cleanroom operation and operability. Instructs graduate students, faculty, and others in the proper use of this equipment, where appropriate.
15%- Trains and supervises faculty, staff, and students in the use of the cleanroom facility and the tools within it. Tests users on general knowledge of tool usage and cleanroom safety before authorizing individuals for cleanroom use.
15%- Operates specialized equipment:
ICP-RIE
Mask Aligner
Nanoimprinter
Hot-embosser
Injection molder
SEM
AFM
Rapid scanning confocal microscope
Ellipsometer
DC Magnetron Sputterer
Thermionics E-beam evaporator with 3 electron sources for thin film deposition
Oxford Instruments plasma-enhanced chemical vapor deposition (PECVD) system for depositing dielectric films
Oxford Instruments inductively-coupled plasma reactive ion etch (ICP-RIE) system capable of deep RIE of silicon-based materials
Position Requirements
Must be able to work in a cleanroom under lighting conditions to accommodate resist processing.
Required Qualifications
PhD or MS in an engineering field with experiences in carrying out lithographic-based processes
Six months’ experience in machine tool technology or certification from an accredited technical school
Preferred Qualifications
Experiences in electroplating of molding tools
Experiences in plastic forming via hot embossing, nanoimprint lithography, and injection molding
Familiarity with cleanroom operation
Ability to multi-task and work cooperatively with others
Additional Candidate Instructions
Complete online application includes: Cover Letter, CV and contact information for three professional references.
Application review begins on February 14th and will continue until a qualified applicant pool has been identified.
Contact Information to Applicants
Emma Goodrich
[email protected]
Advertised Salary Range
Starting at $53,000
Work Schedule
9-5, Monday through Friday
Application Review Begins
15-Feb-2022
Anticipated Start Date
01-Mar-2022