Publications
1] C. L. Gan, E. K. Ng, B. L. Chan, U. Hashim, and F. C. Classe, “Technical Barriers and Development of Cu Wirebonding in Nanoelectronics Device Packaging,” J. Nanomater., vol. 2012, pp. 1–7, 2012 (ISI IF: 1.980)
[2] C. Gan, C. L; Classe, Francis, Chan, B.L; Hashim, “Extended Reliability of Gold and Copper Ball Bonds in Microelectronics Packaging,” Gold Bull., 2013. (ISI IF: 1.706)
[3] C. L. Gan, E. K. Ng, B. L. Chan, F. C. Classe, T. Kwuanjai, and U. Hashim, “Wearout Reliability and Intermetallic Compound Diffusion Kinetics of Au and PdCu Wires Used in Nanoscale Device Packaging,” J. Nanomater., vol. 2013, pp. 1–9, 2013. (ISI IF: 1.980)
[4] C. L. Gan and U. Hashim, “Comparative Reliability Studies and Analysis of Au, Pd- Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging,” PLosone, vol. 8, no. 11, pp. 1–8, 2013. (ISI IF: 3.234)
[5] C. L. Gan and U. Hashim, “Reliability assessment and mechanical characterization of Cu and Au ball bonds in BGA package,” J. Mater. Sci. Mater. Electron., vol. 24, no. 8, pp. 2803–2811, 2013. (ISI IF: 2.220)
[6] C. L. Gan and U. Hashim, “Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging.,” J. Electron. Packag., vol. 135, no. 2, pp. 0210101–210107, Jun. 2013. (ISI IF: 1.787)
[7] C. L. Gan, F. Classe, and U. Hashim, “Superior performance and reliability of copper wire ball bonding in laminate substrate-based ball grid array,” Microelectron. Int., vol. 30, no. 3, pp. 169–175, 2013. (ISI IF: 0.796)
[8] C. L. Gan, C. Francis, B. L. Chan, and U. Hashim, “Extended reliability of gold and copper ball bonds in microelectronic packaging,” Gold Bull., vol. 46, no. 2, pp. 103–115, Apr. 2013. (ISI IF: 1.706)
[9] C. L. Gan and U. Hashim, “Reliability assessment and mechanical characterization of Cu and Au ball bonds in BGA package,” J. Mater. Sci. Mater. Electron., vol. 24, no. 8, pp. 2803–2811, Mar. 2013. (ISI IF: 2.220)
[10] C. L. Gan, F. C. Classe, B. L. Chan, and U. Hashim, “Evolution and investigation of copper and gold ball bonds in extended reliability stressing,” Gold Bull., Mar. 2014. (ISI IF: 1.706)
[11] C. L. Gan, F. C. Classe, B. L. Chan, and U. Hashim, “Effects of Bonding Wires and Epoxy Molding Compound on Gold and Copper Ball Bonds Intermetallic Growth Kinetics in Electronic Packaging,” J. Electron. Mater., vol. 43, no. 4, pp. 1017–1025, Jan. 2014. (ISI IF: 1.774)
[12] C. L. Gan, F. Classe, B. L. Chan, and U. Hashim, “Future and technical considerations of gold wirebonding in semiconductor packaging – a technical review,” Microelectron. Int., vol. 31, no. 2, pp. 121–128, 2014. (ISI IF: 0.796)
[13] C. L. Gan, Classe, Francis; Chan, B.L, U. Hashim, “Book Review: Copper Wire Bonding,” Microelectron. Reliab., vol. 54, p. 490, 2014. (ISI IF: 1.535)
[14] C. L. Gan and U. Hashim, “Influence of shear strength on long term biased humidity reliability of Cu ball bonds,” J. Mater. Sci. Mater. Electron., vol. 25, no. 11, pp. 4786–4792, Aug. 2014. (ISI IF: 2.220)
[15] C. L. Gan and U. Hashim, “Book Review: Wafer-Level Chip-Scale Packaging,” Microelectron. Reliab., p. 11759, 2015. (ISI IF: 1.535)
[16] C. L. Gan and U. Hashim, “Book Review: Fundamentals of Lead-Free Solder Interconnect Technology (from Microstructures to Reliability),” Microelectron. Reliab., vol. 55, no. 5, p. 852, 2015. (ISI IF: 1.535)
[17] C. L. Gan and U. Hashim, “Evolutions of bonding wires used in semiconductor electronics: perspective over 25 years,” J. Mater. Sci. Mater. Electron., pp. 4412–4424, 2015. (ISI IF: 2.220)
[18] C. L. Gan and U. Hashim, “Book Review: Fundamentals of Bias Temperature Instability,” Microelectron. Reliab., vol. 59, p. 140, 2016. (ISI IF: 1.535)
Curriculum Vitae
[19] C. L. Gan and U. Hashim, “Book Review: 3D Stacked Chips: from Emerging Processes to Heterogeneous Systems, ,” Microelectron. Reliab., vol. 63, p. 319, 2016. (ISI IF: 1.535)
[20] C. L. Gan and U. Hashim, “Book Review: 3D Flash Memories” Microelectron. Reliab., vol. 65, p. 327, 2016. (ISI IF: 1.535)
[21] C. L. Gan and U. Hashim, “Book Review: Carbon Nanotubes for Interconnects: Process, Design and Applications” Microelectron. Reliab., vol. 70, p. 122, 2017. (ISI IF: 1.535)
[22] C. L. Gan and U. Hashim, “Book Review: Soft error mechanisms, modeling and mitigation,” Microelectron. Reliab., vol. 74, p. 81, 2017. (ISI IF: 1.535)
[23] C. L. Gan, “Book Review: Reliability Physics and Engineering: Time-to-Failure Modeling”, pp. 463. Life Cycle Reliab Saf Eng 9, 127, (2020)
[24] C. L. Gan, “Book Review: Prognostics and Health Management of Electronics: Fundamentals, Machine Learning, and the Internet of Things”, pp. 225. Life Cycle Reliab Saf Eng 9, (2020)
[25] C. L. Gan, Hem T. “Book Review: Assembly and reliability of lead-free solder joints”, pp. 225. Life Cycle Reliab Saf Eng 9, (2020)
[26] C. L. Gan, Hem T. “Book Review: Fan-Out Wafer-Level Packaging”, pp. 449. Life Cycle Reliab Saf Eng 9, (2020)
[27] C. L. Gan, Y. S. Zou, M. H. Chung, Hem T. “A Review of Interconnect Materials used in Emerging Memory Device Packaging: First & Second Level Interconnect Materials”, J. Electron. Mater, Submitted, 2021