Publications
Papers:
[1] Yu siyuan, Lin bin, Han xuesong et al., Development of nanometer grade micro-displacement system of piezoelectric ceramics, Journal of Tianjin University, 2000, Vol 33(4), 537-540
[2] Lin bin, Han xuesong, Yu siyuan et al., Experimental study on molecular dynamics simulation in nanometer grinding, Journal of Tianjin University, 2000, Vol 33(5), 652-656
[3] Han xuesong, Yu siyuan, Lin bin, The present status of molecular dynamics, Journal of New Technology, 2001, (5), 12-15
[4] Yu siyuan, Lin bin, Han xuesong et al., Molecular dynamics simulation technique and its application to ultraprecision manufacturing regime, Journal of China mechanical engineering, 2002, 13(1), 22-25
[5] Yu siyuan, Han xuesong, Lin bin et al., A study on surface quality of ultraprecision grinding for engineering ceramics, Key Engineering Materials, 2001, 202-203: 35～40
[6] Han xuesong, Lin bin, Yu siyuan et al., Investigation of tool geometry in nanometric cutting by molecular dynamics simulation, Journal of Materials Processing Technology，2002, 129(1-3), 105～108
[7] Han xuesong, Wang shuxin, Yu siyuan, Molecular dynamics simulation of nanometric grinding - the effect of crystal anisotropy on the quality of machined surface, Key Engineering Materials, 2004, 258-259: 361～365
[8] Han xuesong，Wang shuxin, Hu S. Jack，Computer simulation of fuel cell microscopic contact behavior using multibody molecular dynamics method， ACMD2004, 2004, 123-126
[9] Zheng xuemei, Han xuesong, Wang shuxin, Application of parallel programming in mechanical manufacturing field, Journal of Machine tool and Fluid Drive, 2005, (11), 40-42
[10] Han xuesong, Wang shusin, Yu siyuan, Investigation of nanomanufacturing process by molecular dynamics simulation based on symplectic algorithm, Chinese Journal of Mechanical Engineering, 2005, 41(4), 17-21
[11] Xuesong Han, Investigation of machined surface quality about single crystal with vacancy by molecular dynamics simulation, CIS2006, 429-432
[12] Xuesong Han, Investigation of surface integrity in the case of chemical mechanical polishing silicon wafer by molecular dynamics simulation method, Leture notes in computer science, 2006, 4282, 651-659
[13] Xuesong Han, A study of dry polishing micro-mechanism by molecular dynamics simulation method, IEEE NTC Review of advances in micro, nano, and molecular systems, 2006, 1, 936-941
[14] Han xuesong, A Study of Micromechanism of Generated Polishing Surface using Numerical Simulation Method, Applied Surface Science, 2007, 253(14), 6211-6216
[15] Han xuesong, Y Z Hu, Analysis micromechanism of burrs formation in the case of nanometric cutting process using numerical simulation method, Science in China Series E-Technological Sciences, 2007, 50(2), 129-137
[16] Xuesong Han, Y Z Hu, Molecular dynamics simulation of exit fracture in the case of nanometric cutting process, Key Engineering Materials, 2007, 353-358, 1833-1836
[17] Han xuesong, Investigation atomic level micromechanism about tool wear in the case of nanometric cutting using molecular dynamics method, Chinese Journal of Mechanical engineering, 2007, 43(9), 107-112
[18] Xuesong Han, Yuanzhong Hu, Siyuan Yu, Molecular dynamics analysis micro-mechanism of ductile material remove in the case of nanometric cutting single crystal silicon, European Physical Journal-Applied Physics, 2008, 42(3), 255-262
[19] Xuesong Han, Yuanzhong Hu, Siyuan Yu, Investigation materials removal mechanism of silicon wafer in the chemical mechanical polishing process using molecular dynamics simulation method, Applied Physics A, 2009, 95, 899-905
[20] Xuesong Han, Shuxin Wang, Lianhong Zhang, Bin Lin, Siyuan Yu, Numerical studies on deformation and adhesion behaviour of substrate during nanoindentation, Micro & Nano Letters, 2010, 5(4), 225-229
[21] Xuesong Han, Shuxin Wang, Yong X. Gan, Lianhong Zhang, Siyuan Yu, Analysis elastic-plastic behavior and anisotropy properties of copper film from nanoindentation using numerical computation method, Micro & Nano Letters, 2011, 6(1), 13-18
[22] Xuesong Han, Yong X. Gan, Analysis the complex interaction among flexible nanoparticles and materials surface in the mechanical polishing process, Applied Surface Science, 2011, 257(8), 3363-3373
Book :
《The Frontiers of Tribology》, China Science Press, 2006 (Being one of the authors)
