Publications
Chun-Han Lai, Yu-Lin Yang, Li-Yin Chen, Yi-Jui Huang, Jing-Yu Chen, Pu-Wei Wu*, Yu-Ting Cheng, and Yang-Tung Huang, “Effect of Crystallinity on the Optical Reflectance of Cylindrical Colloidal Crystals”, Journal of The Electrochemical Society, Vol. 158, No. 3, p. P37-P40, 2011.
Tzu-Yuan Chao, Chia-Wei Liang, Y.-T. Cheng, and Chien-Nan Kuo”, “Heterogeneous Chip Integration Process for Flexible Wireless Microsystem Application”, IEEE Trans. Elec. Dev., Vol. 58, pp. 906-909, 2011.
Tzu-Yuan Chao, M. C. Hsu, Cheng-De Chando Lin, and Y. T. Cheng, “SU-8 serial MEMS switch for flexible RF applications”, accepted to appear in Journal of Micromechanics and Microengineering, Vol. 21, pp. 025010-025015, 2011.
C. C. Chen, Y. C. Chen, Chin-Ta Chen, Hsu-Liang Hsiao, Chia-Chi Chang, Y. T. Cheng, IEEE, and Mount-Learn Wu, “Thermal Analysis: VCSELs on a SiOB”, accepted to publish in IEEE Journal of Selected Topics in Quantum Electronics, 2011.
Y. C. Chen, C. C. Chen, W. Tu, Y. T. Cheng, and F. G. Tseng, ” Design and Fabrication of A Microplatform for The Proximity Effect Study of Localized ELF-EMF on The Growth of in-Vitro HeLa and PC-12 Cells”, publish in Journal of Micromechanics and Microengineering, Vol. 20, pp. 125023-125032, 2010.
T. Y. Chao, C. H. Li, Y. C. Chen, H. Y. Chen, Y. T. Cheng, C. N. Kuo, “An Interconnecting Technology for RF MEMS Heterogeneous Chip Integration”, IEEE Trans. Elec. Dev., Vol. 57, pp. 928-938, 2010.
Chia-Yeh Yang , Y. T. Cheng, and W. S. Hsu, “The Investigation of Nano-roughening Effect on the Reliability Enhancement of Adhesive Bond for NEMS Manufacturing Application”, IEEE Trans. Adv. Pack., Vol. 33, pp. 356-361, 2010.
Chien-Min Liu, Yuan-Chieh Tseng, Chih Chen, Ming-Chieh Hsu, Tzu-Yzan Chao, and Yu-Ting Cheng, “Superparamagnetic and Ferromagnetic Ni Nanorod Arrays Fabricated on Si Substrates using Electroless Deposition”, Nanotechnology, Vol. 20, pp. 415703-415709, 2009.
C. C. Chen, Lun-Hao Hsu, Kai Rern, Y. T. Cheng, Yi-Fan Hsieh, and Pu-Wei Wu, “Gravity-Assisted Seeding Control for One-Dimensional Material Growth”, IEEE Trans. on Nanotech., Vol. 8, pp. 427-430, 2009.
M. Hsu, T. Y. Chao, Y. T. Cheng, C. Liu, C. Chen, “The Inductance Enhancement Study of Spiral Inductor Using Ni-AAO Nanocomposite Core”, IEEE Trans. on Nanotech., Vol. 8, pp. 281-285, 2009.
Chia-Sheng Huang, Junwei Chung, Yu-Ting Cheng, Wensyang Hsu, “Investigation of Ni-based Thermal Bimaterial Structure for Sensor and Actuator Application”, Sensors and Actuators, Physical A, Vol. 149, pp. 298-304, 2009.
Jingkuang Chen, Xiaoyang Cheng, Chien-Chang Chen, Pai-Chi Li, Jian-Hung Liu, and Yu-Ting Cheng, “A Capacitive Micromachined Ultrasonic Transducer Array for Minimally Invasive Medical Diagnosis”, IEEE/ASME J. Microelectromechanical Systems, Vol. 17, pp. 599-610, June 2008.
C. C. Chen, Ssu-Ying Chen, and Y. T. Cheng, “A Patterned Dielectric Support Process for High Performance Passive Fabrication”, IEEE Microwave Component Letter,Vol. 18, pp.82-84, 2008.
Yu Wen Huang, Tzu-Yuan Chao, C. C. Chen, and Y. T. Cheng, “A Power Consumption Reduction Scheme of Magnetic Microactuation Using Electroplated Cu-Ni Nanocomposite”, Appl. Phys. Lett., Vol. 90, pp. 244105-244107, 2007.
C. M. Yeh, M. Y. Chen, J-Y Gan, J. Hwang, C. D. Lin, T. Y. Chao, and Y. T. Cheng, “Gravity-assisted Chemical Vapor Deposition of Vertically Aligned Single-walled Carbon Nanotubes - Effects of Temperature and CH4/H2 ratio”, Journal of the Electrochemical Society, Vol. 154, K15-K17, 2007.
C. M. Yeh, M. Y. Chen, J-Y Gan, J. Hwang, C. D. Lin, T. Y. Chao, and Y. T. Cheng, “Effects of Time on the Quality of Vertically Oriented Single-Walled Carbon Nanotubes by Gravity-Assisted Chemical Vapour Deposition”, Nanotechnology, Vol. 18, no. 14, pp. 145613, 2007.
C. T. Kou, T. Y. Chao, I. Ta Chiang, and Y. T. Cheng, “Wafer Level Fabrication of Hermetically Sealed Microcavity with Robust Metal Interconnects for Chip Cooling Applications”, Sensors and Actuators, Physical A, Vol. 139, pp. 259-264, 2007.
C. C. Chen, Cheng-De Lin, and Y. T. Cheng, “Model to Determine the Self-Resonant Frequency of Micromachined Spiral Inductors”, Appl. Phys. Lett., Vol. 89, no. 10, pp. 103521-103523, 2006.
Li-Nuan Tsai, Yu-Ting Cheng, Wensyang Hsu, and Weileun Fang, “Ni-carbon Nanotubes Nanocomposite for Robust Microelectromechanical Systems Fabrication”, J. Vac. Sci. Tech. B., Vol. 24, pp. 205-210, 2006.
Tzu-Yuan Chao, Guang-Ren Shen, and Y. T. Cheng, “Comparartive Study of Ni-P-Diamonds and Ni-P-CNTs Nanocomposite Films”, Journal of the Electrochemical Society, Vol. 153, G98-G104, 2006.
Li-Nuan Tsai, Guang-Ren Shen, Y. T. Cheng, and Wensyang Hsu, “Performance Improvement of an Electrothermal Microactuator Using Ni-Diamond Nanocomposite”, IEEE/ASME J. Microelectromechanical Systems, Vol. 15, pp. 149-159, 2006.
Zhi-Hao Liang, Y. T. Cheng, W. Hsu, and Yuh-Wen Lee, “A Wafer-Level Hermetic Encapsulation for MEMS Manufacture Application”, IEEE Trans. Adv. Pack.,Vol. 29, 513-519, 2006.
C. C. Chen, J. K. Huang, and Y. T. Cheng, “A Closed-Form Integral Model of the Spiral Inductor Using Kramers Kronig Relations”, IEEE Microwave Component Letter, Vol. 15, pp.778 – 780, 2005
Kwok-Siong Teh, Yu-Ting Cheng and Liwei Lin, "MEMS Fabrication Based on Nickel-Nanocomposite: Film Deposition and Characterization," Journal of Micromechanics and Microengineering, Vol. 15, pp. 2205-2215, 2005.
Guang-Ren Shen, Y. T. Cheng, and Li-Nuan Tsai, “Synthesis and Characterization of Ni-P-CNTs Nanocomposite Film for MEMS Applications”, IEEE Trans. on Nanotech. Vol. 4, pp. 539 – 547, 2005.
J. W. Lin, C. C. Chen, and Y.-T. Cheng “A Robust High Q Micromachined RF Inductor for RFIC Applications”, IEEE Trans. on Elec. Dev. , Vol. 52, pp. 1489- 1496, 2005.
Y. T. Cheng, W.T. Hsu, K. Najafi, C. T. Nguyen and Liwei Lin, "Vacuum Packaging Technology Using Localized Aluminum/Silicon-to Glass Bonding", IEEE/ASME Journal of Microelectromechanical Systems , Vol. 11, pp. 556-565, 2002.
Y. T. Cheng, Liwei Lin, Khalil Najafi, “Fabrication and Hermeticity Testing of A Glass-Silicon Packaging Formed Using Localized Aluminum/Silicon-to-Glass Bonding”, IEEE/ASME Journal of Microelectromechanical Systems, Vol. 10, pp. 392~399, Sep., 2001.
Y. T. Cheng, Liwei Lin and Khalil Najafi, "Localized Silicon Fusion and Eutectic Bonding for MEMS Fabrication and Packaging", IEEE/ASME Journal of Microelectromechanical Systems, Vol. 9, pp. 3-8, March 2000.
Liwei Lin, Y. T. Cheng and K. Najafi, “Formation of Silicon-Gold Eutectic Bond Using Localized Heating Method”, Japanese Journal of Applied Physics, Part II, Vol. 11B, pp. 1412-1414, Nov. 1998.
Liwei Lin, Y. T. Cheng and C.-J. Chiu, "Comparative Study of Hot Embossed Microstructures Fabricated by Laboratory and Commercial Environments ", Microsystem Technologies Journal, Vol. 4, No. 3, pp. 113-116, 1998.
Y. T. Cheng, S. J. Lin, J. Hwang. “The effect of diamond facet on the electrical properties of Pt/BF2+ ion implanted polycrystalline diamond”. Appl. Phys. Lett. 63 (24), pp. 3344-3346, 1993.
Tzu-Yuan Chao, Kuei-Shu Li, and Y. T. Cheng. “SU-8 Flexible Ribbon Cable for Biomedical Microsystem Interconnection”, to appear in IEEE NEMS 2011.
T. .Y Chiao, and Y. T. Cheng, “Wafer-Level Chip Scale Flexible Wireless Microsystem Fabrication”, IEEE Micro Electro Mechanical Systems Conference, pp.344-347, 2011.
Yi-Chia Lee, Y. T. Cheng, and Wensyang Hsu, “Electroplating Process of Ni-CNTs Nanocomposite for MEMS Resonantor Fabrication”, IEEE Micro Electro Mechanical Systems Conference, pp.416-419, 2011.
Y. C. Chen, and Y. T. Cheng, “A Low-power Electromagnetic Microspeaker Using a PDMS Membrane for Hearing Aids Application”, IEEE Micro Electro Mechanical Systems Conference, pp.1213-1216, 2011.
C.-M. LaI, T.-Y. Chao#2, W.-A. Tsou, M.-F. Chou, Y.-T. Cheng, and K.-A. Wen, “A Polar Modulated Tri-band Power Amplifier Using Flexible Substrate Based MEMS Switches”, Proceedings of the 40th European Microwave Conference, Paris, pp. 998-1001, 2010.
C. C. Chen, Y. C. Chen, Keng-Yu Lin, and Y. T. Cheng, “Hybrid Biomimetic Directional Microphone for The Full Space Sound Source Localization”, Hilton Head Workshop 2010, A Solid-State Sensors, Actuators and Microsystems Workshop, pp. 96-97, 2010. (Late News)
C. C. Chen, C. Singh, Y. C. Chen, Hsu-Liang Hsiao, Chia-Yu Lee, Mount-Learn Wu, and Y. T. Cheng, “Equivalent Electrothermal Circuit Model for Vertical-Cavity Surface-Emitting Lasers on Silicon Optical Bench,” 15th International Workshop on Thermal investigations of ICs and Systems (THERMINIC), Leuven, Belgium, pp. 8-12, 7-9 October, 2009.
C. C. Chen, Lun-Hao Hsu, and Y. T. Cheng, “Formation, Rolling, and Agglomeration of a Co Seed Droplet in Patterned Inverted Silicon Nano-Pyramid,” IEEE 9th International Conference on Nanotechnology digest, Genoa, Italy, 26-30 July, pp. ,2009.
Y. C. Chen, C. C. Chen, W. T. Tu, Y. T. Cheng, F. G. Tseng, “The Investigation of the Proximate Effect of Time-variant magnetic Field on the Growth of In-vitro Hela and PC-12 cells Using On-glass Spiral Inductor,” in Proceedings of the 5th International Conference on Microtechnologies in Medicine and Biology, Quebec, Canada, pp. 216 - 217, Apr 1 - 3, 2009.
C. S. Huang, Y.T. Cheng, C.J. Yeh, H. K. Liu, and W. Hsu, “Young’s Modulus and Fatique Lifetime Improvements by Diamond Size Effect on Electroplated Ni-Diamond Nanocomposite”, IEEE Transducers09, pp180-183, 2009
Y. C. Chen, Wei-Ting Liu, Tzu-Yuan Chao, and Y. T. Cheng, “An Optimized Cu-Ni Nanocomposite Coil for Low-power Electromagnetic Microspeaker Fabrication”, IEEE Transducers09, pp. 25-28, 2009
Y. C. Chen, C. C. Chen, Wen Hao Ching and Y. T. Cheng, “Design and Fabrication of High Performance Biomimetic Microphpone Using Oxalis-Like Sensing Diaphragm for Sound Localization”, accepted by APCOT 2008.
Yu Wen Huang, Tzu-Yuan Chao and Yu-Ting Cheng, “Synthesis and Device Fabrication of Cu-Ni Nanocomposite for Low-power Magnetic Microactuation”, IEEE Int. Conf. on Nanotechnology, Aug., pp. 899-902, 2007
Chun-Hsing Li, Chang Tsung Fu, Tzu-Yuan Chao, Chien-Nan Kuo, Y. T. Cheng, and D.-C. Chang “Broadband Flip-Chip Interconnects for Millimeter-Wave Si-Carrier System-on-Package”, IEEE IMS-MTT, pp.1645-1648, June, 2007.
Chia-Sheng Huang, Junwei Chung, Yu-Ting Cheng, and Wensyang Hsu, “Thermal Bimetallic Microactuators by Ni and Ni-diamond Nanocomposite”, 2nd IEEE Int. Conf. on NEMS, pp. 37-40, Jan., 2007.
Y. C. Chen, C. H. Li, J. K. Huang, C. N. Kuo, and Y. T. Cheng, “Low Power 3~8-GHz UWB Tunable LNA Design Using SiP Technology”, IEEE ICECS, pp. 1026-1029, Dec.,2006.
Tzu-Yuan Chao and Y. T. Cheng, “Synthesis and Characterization of Cu/CoFe2O4 Magnetic Nanocomposite for RFIC Application”, IEEE Int. Conf. on Nanotechnology, pp. 810-813, 2006.
C. T. Kou, T. Y. Chao, I. Ta Chiang, and Y. T. Cheng, “Wafer Level Fabrication of Hermetically Sealed Microcavity with Robust Metal Interconnects for Chip Cooling Applications”, accepted to be published in APCOT 2006.
Chia-Yeh Yang , Y. T. Cheng, and W. S. Hsu, “Nano-Roughening for Reliable N/MEMS Manufacture”,1st IEEE Int. Conf. on NEMS, pp. 153-156, 2006.
Li-Nuan Tsai, Y. T. Cheng, Wensyang Hsu, “Ni-CNTs Nanocomposite for Robust MEMS Fabrication”, 1st ICON 2005, pp. 40-41, Jan., 2005.
Li-Nuan Tsai, Y. T. Cheng, Wensyang Hsu, “Nanocomposite Effects on The Coefficient of Thermal Expansion Modification for High Performance Electro-Thermal Microactuator”, IEEE Micro Electro Mechanical Systems Conference, pp. 467-470, Jan., 2005.
Guang-Ren Shen, Li-Nuan Tsai, Y. T. Cheng, Wensyang Hsu, “Ni-P-CNTs Nanocomposite Film for MEMS Applications”,IEEE Conf. on Nanotechnology, München, Germany, pp. 192-194, Aug, 2004.
Jr-Wei Lin, C. C. Chen, J. K. Huang, and Y. T. Cheng, “An Optimum Design of The Micromachined RF Inductor”, Radio Frequency Integrated Circuits (RFIC) Symposium, 2004. Digest of Papers. 2004 IEEE , June 6-8, 2004, pp. 639~642
Li-Nuan Tsai, Guang-Ren Shen, Yu-Ting Cheng, Wensyang Hsu “Power and Reliability Improvement of an Electro-Thermal Microactuator Using Ni-Diamond Nanocomposite”, Electronic Components and Technology Conference, 2004. ECTC '04. Proceedings ,Volume: 1 , June 1-4, 2004, pp. 472~476.
Zhi-Hao Liang, Yu-Ting Cheng, W. Hsu, Yuh-Wen Lee, “A Low Temperature Wafer-Level Hermetic Package Using UV Curable Adhesive”, Electronic Components and Technology, 2004. ECTC '04. Proceedings, Volume: 2 , June 1-4, 2004, pp.1486~1491.
K. S. Teh, Y. T. Cheng, and L. Lin, "Using Nickel Nanocomposite Films For the Fabrication of MEMS Microresonators", The 14th International Conference on Composite Materials, Technical Digest, ID1446, San Diego, USA, July 14-18, 2003.
K. S. Teh, Y. T. Cheng, and Liwei Lin, “Nickel Nano-Composite Film For MEMS Applications”, 12th Int. Conference on Solid State Sensors and Actuators, Transducer's 03, Technical Digest, Boston,USA, June 2003.
K. S. Teh, Y. T. Cheng, and Carlos Sambucetti, “Selective Plating of Nickel Ceramic Composite Films for MEMS Applications”, IEEE Micro Electro Mechanical Systems Conference, Jan., 2002, pp. 384~387.
Y. T. Cheng, Carlos Sambucetti, and K. S. Teh, “Fabrication of Micropipes for Optical Interconnects Using Electroless Processes”, published in Proceedings of 2001ASME, CD ROM, Vol 2, IMECE, Nov., 2001.
Y. T. Cheng, W. T. Hsu, Liwei Lin, C. T. Nguyen, Khalil Najafi, “Vacuum Packaging Using Localized Aluminum/Silicon-to-Glass Bonding Using Localized Aluminum/Silicon-to-Glass Bonding”, Proceedings of IEEE Micro Electro Mechanical Systems Conference, Jan. 2001, pp.18~21.
Y. T. Cheng, Liwei Lin, Khalil Najafi, “Fabrication and Hermeticity Testing of A Glass-Silicon Packaging Formed Using Localized Aluminum/Silicon-to-Glass Bonding”, Proceedings of IEEE Micro Electro Mechanical Systems Conference, Jan. 2000, pp.757~762.
G. He, Liwei Lin and Y. T. Cheng, "Localized CVD Bonding for MEMS Packaging", 10th Int. Conference on Solid State Sensors and Actuators, Transducer's 99, Technical Digest, Sendai, Japan, June 1999, pp. 1312-1315.
Yu-Ting Cheng, Liwei Lin and Khalil Najafi, “Localized Bonding with PSG or Indium Solder as Intermediate Layer”, Proceedings of IEEE Micro Electro Mechanical Systems Conference, pp. 285-289, Jan. 1999, Orlando, Florida.
Y. T. Cheng, Liwei Lin and Khalil Najafi, "Localized Silicon Fusion and Eutectic Bonding for MEMS Fabrication and Packaging", Proceedings 1998. Solid-State Sensors and Actuators Workshop, pp. 233-236, Hilton Head, SC, June. 7-10, 1998.
Y. T. Cheng, S. L. Lee, M. S. Hsu, K. C. Huang, J. Hwang, “The bonding characteristics of BF2+ion implanted synthetic diamond films”, Proceeding of 1992 annual conference of Chinese Society for Material Science. pp.546-548.
Book Chapters:
1.Yu-Chuan Su, JongBaeg Kim, Yu-Ting Cheng, Mu Chiao and Liwei Lin, "Packaging and Reliability Issues in Micro/Nano Systems," Handbook or Nanotechnology, 3rd edition Springer-Verlag Berlin Heidelberg, ISBN-978-3-642-02524-2, pp. 1835-1863, 2010.
2.JongBaeg Kim, Yu-Ting Cheng, Mu Chiao and Liwei Lin, "Packaging and Reliability Issues in Micro/Nano Systems," Handbook or Nanotechnology, 2nd edition Springer-Verlag Berlin Heidelberg, ISBN-10:3-540-29855-X, pp. 1777-1803, 2007.
2.Y.T. Cheng and Liwei Lin, "MEMS Packaging and Thermal Issues in Reliability," Handbook or Nanotechnology, Springer-Verlag Berlin Heidelberg, ISBN 3-540-01218-4, pp. 1111-1132, Jan. 2004.
3.Ph.D. Thesis, "Localized heating and bonding for MEMS package", 2000.
4.Master Thesis, ”The reliability of the electrical properties of Pt(Au)/polycrystalline diamond contacts”, 1993.
Patents
1.Liwei Lin, Yu-Ting Cheng, Khalil Najafi and Kensall Wise, “Microstructures”, US Patent. No. 6,232,150, May 15, 2001.
2.Liwei Lin, Yu-Ting Cheng, Khalil Najafi and Kensall Wise, "Microstructures," US patent, No. 6,436,853 August 20, 2002.
3.Yu-Ting Cheng, Stefanie Ruth Chiras, Donald W. Henderson, Sung-Kwon Kang, Stephen James Kilpatrick, Henry A. Nye, III, Carlos J. Sambucetti, Da-Yuan Shih, “Ball limiting metallurgy, interconnection structure including the same, and method of forming an interconnection structure”, US patent, No. 7,273,803, September 25, 2007.
4.Chien-Chang Chen, and Yu-Ting Cheng, “Method for predicting inductance and self-resonant frequency of a spiral inductor”, US patent, No. 7,451,415, November 11, 2008.
5. Yu-Ting Cheng, Sherif A Goma, John Harold Magerlein, Sampath Purushothaman, Calos Juan Sambucetti, and George Frederick Walker, “Technology for fabrication of packaging interface substrate wafers with fully metallized vias through the substrate wafer”, US patent, No. 7,880,305, Feburary 1, 2011.
