Publications
(1) Lin, Y. Y.* and S. P. Lo, 2005, “Modeling of Chemical Mechanical Polishing Process Using FEM and Abductive Network,” Journal of Engineering Application of Artificial Intelligence, Vol.8, pp.373-381. (SCI)
(2) Lo, S. P. and Y. Y. Lin, 2005, “The Prediction of Wafer Surface Nonuniformity Using FEM and ANFIS in the Chemical Mechanical Polishing Process,” Journal of Materials Processing Technology, Vol.168, pp.250-pp.257. (SCI, EI)
(3) Lin, Y. Y.*, S. P. Lo and C. Y. Chen, 2006, “Strain and Stress Analysis of Oxide Film Surface in Chemical Mechanical Polishing Process,” International Journal of Computer Applications in Technology, Vol.26, No.4, pp.233-241. (EI)
(4) Lo, S. P., D. Y. Chang and Y. Y. Lin, 2007, “Quality Prediction Model of the Sheet Blanking Process for Thin Phosphorous Bronze,” Journal of Materials Processing Technology, Vol.194, pp.126-133. (SCI, EI) (NSC 90-2212-E-237-005)
(5) Lin, Y. Y.*, 2007, “Influence of a Retaining Ring on Strain and Stress in Chemical Mechanical Polishing Process,” Materials and Manufacturing Processes, Vol.22, pp.871-878. (SCI, EI)
(6) Lo, S. P., Y. Y. Lin and J. C. Huang, 2007, “Analysis of Retaining Ring Using Finite Element Simulation in Chemical Mechanical Polishing Process,” International Journal of Advanced Manufacturing Technology, Vol. 34, pp.547-555. (SCI)
(7) Chiu, J. T., Y. Y. Lin, C. L. Shen, S. P. Lo and W. J. Wu, 2008, “Atomic-Scale Finite Element Model of Tension in Nano-Scale Thin Film,” International Journal of Advanced Manufacturing Technology, Vol.37, pp.76-82. (SCI)
(8) Chiu, J. T. and Y. Y. Lin, 2008, “Modal Analysis of Multi-Layer Structure for Chemical Mechanical Polishing Process,” International Journal of Advanced Manufacturing Technology, Vol.37, pp.83-91. (SCI)
(9) Lin, Y. Y.*, S. P. Lo, S. L. Lin and J. T. Chiu, 2008, “A Hybrid Model Combining Simulation and Optimization in Chemical Mechanical Polishing Process,” Journal of Materials Processing Technology, Vol. 202, pp.152-164. (SCI, EI)
(10) Chiu, J. T. and Y. Y. Lin, 2008, “Optimization of Carrier Morphology in terms of Fourier Sine Series for Chemical Mechanical Polishing Process,” International Journal of Advanced Manufacturing Technology, Vol.39, pp.414-420. (SCI) (NSC 94- 2212- E- 237- 002)
(11) Hsu, C. Y., Y. Y. Lin, W. S. Lee and S. P. Lo, 2008, “Study on Machining Characteristics of Inconel 718 Using Ultrasonic and High Temperature Aided Cutting,” Journal of Materials Processing Technology, Vol.198, pp.359-365. (SCI, EI)
(12) Lin, Y. Y.*, D., Y. Chen and C. Ma, 2009, “Simulations of a Stress and Contact Model in Chemical Mechanical Polishing Process,” Thin Solid Films, Vol.517, pp.6027-pp.6033. (SCI) (NSC 92-2212-E-237-008)
(13) Lo, S. P., D. Y. Chang and Y. Y. Lin*, 2010, “Relationship between the Punch-Die Clearance and Shearing,” Materials and Manufacturing Processes, Vol.25, pp.786-pp.792. (SCI). (NSC 90-2212-E-237-005)