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hongwei zhao

Mechanical science and engineering
Jilin University

Publications

1. Hu Huang, Hongwei Zhao(*), Jie Mi, Jie Yang, et al.. Experimental research on a modular miniaturization nanoindentation device. Review of Scientific Instruments, 2011, Vol.82, Issue 9 (SCI,IF 1.598)
2. Hu Huang, Hongwei Zhao(*), Jie Yang, et al.. Design and analysis of a miniaturization nanoindentation and scratch device. Advanced Materials Research, 2011, Vols.314-316, pp.1792-1795 (EI)
3. Hu Huang, Hongwei Zhao(*), Zhichao Ma, et al.. Design and analysis of the precision-driven unit for nano-indentation and scratch test. Journal of Manufacturing Systems, 2011,Published online (SCI,IF 0.194)
4. Ma Zhichao, Hu Leilei, Zhao Hongwei(*), Wu, Boda, Peng Zhenxing; Zhou Xiaoqin, et al. Theoretical and experimental research on machine tool servo system for ultra-precision position compensation on CNC lathe. Proceedings of SPIE - The International Society for Optical Engineering,,2010,Vol.7544 (EI)
5. Hu Huang, Hongwei Zhao(*), Jinqiang Deng, et al. The compact Platform for In Situ Nanoindentation and Scratch Test. Advanced Materials Research, 2010, Vol.97-101, pp.4342-4345 (EI)
6. Xiaoqin Zhou, Wencai Wang, Hongwei Zhao. Moment stability of stochastic regenerative cutting process. Advanced Materials Research Vols. 97-101 (2010) pp 3038-3041 (EI)
7. Xiaojun Wang, Junyi Yu, and Hongwei Zhao. Study on Identification of Stable Spindle Speeds Range by Time-varying Cutting Width in Turning. Applied Mechanics and Materials Vols. 37-38 (2010) pp 1296-1300 (EI)
8. Jiwang Yan, Hongwei Zhao, Tsunemoto Kuriyagawa. Effects of tool edge radius on ductile machining of silicon: an investigation by FEM. Semiconductor Science and Technology, 24, 7 (2009) 075018 (SCI,IF 1.32)
9. J. Yan, H. Zhao, J. Tamaki, T. Kuriyagawa. Surface and subsurface damages in nanoindentation tests of compound semiconductor InP. Journal of Micromechanics and Microengineering, 2008, Vol.18, pp.105018(10pp) (SCI,IF 2.00)
Member
Grade: Member

Member since June 26, 2011
Contact Details
Address: Renmin Street 5988, Nanling Campus Jilin University
Phone: +86-13578913791
Email: visible to members only
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